FAILURE MECHANISM ANALYSIS AND PROCESS IMPROVEMENT ON TIME-DEPENDENT DIELECTRIC BREAKDOWN OF CU/ULTRA-LOW-K DIELECTRIC BASED ON COMPLEMENTARY RAMAN AND FTIR SPECTROSCOPY STUDY

Time-dependent dielectric breakdown (TDDB) is one of the most important reliability issues in Cu/low-k technology development.With continuous technology scalings to nanometer scales, TDDB issue is further exacerbated.In this paper, two failure mechanisms were investigated: the Ta ions migration model and the line-edge-roughness (LER) sukrensi.com m

DNA methylation is traditionally thought to be established during early development and to remain mostly unchanged thereafter in healthy tissues, although recent studies have shown that this epigenetic mark can be more dynamic.Epigenetic changes occur in the liver after birth, but the read more timing and underlying biological processes leading to

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